FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation
Author:
Affiliation:
1. Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Palaiseau, France
Abstract
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
https://www.mdpi.com/2072-666X/14/7/1312/pdf
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3. Gillot, C., Lagoutte, E., Charvet, P.L., Souchon, F., and Sillon, N. (2005, January 27–29). Wafer level thin film encapsulation for MEMS. Proceedings of the 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China.
4. MEMS packaging process by film transfer using an anti-adhesive layer;Brault;Microsyst. Technol.,2010
5. BCB cap packaging of MEMS switches integrated with 100-μm MMIC wafer;Seok;IEEE Trans. Compon. Packag. Manuf. Technol.,2013
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