Ultra-high-density interconnection technology of three-dimensional packaging-Reference-Cited by-同舟云学术

Ultra-high-density interconnection technology of three-dimensional packaging

Published:2003-08 Issue:8 Volume:43 Page:1267-1279
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Takahashi Kenji,Umemoto Mitsuo,Tanaka Naotaka,Tanida Kazumasa,Nemoto Yoshihiko,Tomita Yoshihiro,Tago Masamoto,Bonkohara Manabu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference43 articles.

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4. Yoshida A, Zoba D, Lee CH, Lee SG, Kim YH, Park SS, et al. An extremely thin, BGA format chip scale package and stacking. In: 2001 Int Conf Electron Packaging Proc, 2001 ICEP, Tokyo, Japan, April 2001. p. 44–7

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