Study of low-temperature direct bonding of (111) and (100) silicon wafers under various ambient and surface conditions-Reference-Cited by-同舟云学术

Study of low-temperature direct bonding of (111) and (100) silicon wafers under various ambient and surface conditions

Published:2000-03 Issue:1 Volume:80 Page:68-76
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Resnik Drago,Vrtačnik Danilo,Aljančič Uroš,Amon Slavko

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. Wafer bonding for silicon-on-insulator technologies;Lasky;Appl. Phys. Lett.,1986

2. Silicon-to-silicon direct bonding method;Shimbo;J. Appl. Phys.,1986

3. L. Ristic (Ed.), Sensor Technology and Devices, Artech House, Boston, 1994.

4. S.M. Sze (Ed.), Semiconductor Sensors, Wiley, New York, 1994.

5. Low temperature wafer direct bonding;Tong;J. Microelectromech. Syst.,1994

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