Funder
University of Wolverhampton UK
Subject
Industrial and Manufacturing Engineering,Hardware and Architecture,Software,Control and Systems Engineering
Reference29 articles.
1. Reliability behavior of lead-free solder joints in electronic components;Zhang;J Mater Sci: Mater Electron,2013
2. Handbook of lead-free solder technology for microelectronic assemblies,2004
3. Lead-free solders in microelectronics;Abtew;Mater Sci Eng,2000
4. Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy;Yang;Mater Des,2015
5. Thermal fatigue reliability analysis and structural optimization based on a robust method for microelectronics FBGA packages;Wan;IEEE Trans Dev Mater Reliab,2015
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