In situ observations of the real-time stress-evolution and delamination of thin Ta films on Si(100)
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Adhesion and fracture of tantalum nitride films
2. Phase formation behavior and diffusion barrier property of reactively sputtered tantalum-based thin films used in semiconductor metallization
3. Stress–temperature behavior of unpassivated thin copper films
4. Compressive Stress Increase With Repeated Thermal Cycling in Tantalum(Oxygen) Thin Films
5. The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films
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