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Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation

  • Published:2022-04 Issue: Volume:434 Page:134684
  • ISSN:1385-8947
  • Container-title:Chemical Engineering Journal
  • language:en
  • Short-container-title:Chemical Engineering Journal

Author:

Zhang Yonglin,Yao Peilun,Han Yuzi,Yang Jun,Chen Haibin,Wu Jingshen,Yang Jinglei

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference37 articles.

1. 3D microelectronic packaging: from fundamentals to applications;Li;Springer,2017

2. 3-D hyperintegration and packaging technologies for micro-nano systems;Lu;Proc. IEEE.,2009

3. A review of 3-D packaging technology;Al-Sarawi;IEEE Trans. Components, Packag. Manuf. Technol. Part B.,1998

4. Three-dimensional integrated circuit (3D IC) key technology: through-silicon via (TSV);Shen;Nanoscale Res. Lett.,2017

5. Cu filling of TSV using various current forms for three-dimensional packaging application;Roh;Solder. Surf. Mt. Technol.,2013

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