Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers-Reference-Cited by-同舟云学术

Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

Published:2022-07 Issue: Volume:439 Page:135621
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Sun Zhijian,Wong Ryan,Yu Michael,Li Jiaxiong,Zhang Mingyue,Mele Lydia,Hah Jinho,Kathaperumal Mohanalingam,Wong Ching-Ping

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference58 articles.

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4. Direct liquid cooling of high flux micro and nano electronic components;Bar-Cohen;Proc. IEEE.,2006

5. Evaluation of single phase flow in microchannels for high heat flux chip cooling—thermohydraulic performance enhancement and fabrication technology;Kandlikar;Heat Transf. Eng.,2004

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