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The efficiency of inspection based on out of control detection in wafer fabrication

  • Published:2016-09 Issue: Volume:99 Page:458-464
  • ISSN:0360-8352
  • Container-title:Computers & Industrial Engineering
  • language:en
  • Short-container-title:Computers & Industrial Engineering

Author:

Tirkel Israel

Publisher

Elsevier BV

Subject

General Engineering,General Computer Science

Reference26 articles.

1. An optimization approach to capacity expansion in semiconductor manufacturing facilities;Bard;International Journal of Production Research,1999

2. Activity based budgeting at digital semiconductor;Block;International Journal of Strategic Cost Management,1999

3. Multi-objective optimization using evolutionary algorithms;Deb,2001

4. The economic design of X-charts used to maintain current control of process;Duncan;Journal of the American Statistical Association,1956

5. Multi-criteria optimization;Ehrgott,2005

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1. UnionMixup and max-min-saliency mixup for mixed-type defect recognition of wafer bin maps;IEICE Electronics Express;2024-05-25

2. Quality costs and Industry 4.0: inspection strategy modelling and reviewing;The International Journal of Advanced Manufacturing Technology;2024-02-09

3. AlignMixup-based classification of mixed-type defect patterns in wafer bin maps;2023 4th International Conference on Mechatronics Technology and Intelligent Manufacturing (ICMTIM);2023-05-26

4. Mixup-based classification of mixed-type defect patterns in wafer bin maps;Computers & Industrial Engineering;2022-05

5. Inspection procedures in manufacturing processes: recent studies and research perspectives;International Journal of Production Research;2020-05-28
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