Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal-Reference-Cited by-同舟云学术

Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Published:2008-06 Issue:1-3 Volume:202 Page:22-26
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Chang S.Y.,Chuang T.H.,Tsao L.C.,Yang C.L.,Yang Z.S.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference12 articles.

1. Joining alumina to Inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal;Chang;J. Mater. Eng. Perform.,2003

2. Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates;Chai;Ceram. Int.,1998

3. Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler;Chang;J. Mater. Eng. Perform.,2003

4. Active soldering of ITO to copper: active soldering of indium-tin-oxide (ITO) sputtering targets to Cu backing plates using an Sn56Bi4Ti(Ce, Ga) filler;Chang;Weld. J.,2006

5. Low temperature bonding of alumina/alumina and alumina/copper in air using an Sn3.5Ag4Ti(Ce;Chang;Ga) filler. J. Electron. Mater.,2007

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