Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference24 articles.
1. The effect of thin film stress levels on CMP polish rates for PETEOS wafers;McGrath;J. Mater. Process. Technol,2002
2. J. McGrath, C. Davis, The effect of wafer and pad shape on removal uniformity—a qualitative analysis using a mechanistic model, in: CMP-MIC Conference, 2003, pp. 179–182.
3. Optical interferometry for surface measurements of CMP pads;Stein;J. Electron. Mater,1996
4. Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads;Stavreva;Appl. Surface Sci,1997
5. Effect of polishing pad material properties on chemical mechanical polishing (CMP) processes;Bajaj;Mater. Res. Soc. Symp. Proc,1994
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