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Development and characterization of ultra high aspect ratio microstructures made by ultra deep X-ray lithography

  • Published:2015-11 Issue: Volume:225 Page:170-177
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Nazmov Vladimir,Reznikova Elena,Mohr Juergen,Schulz Joachim,Voigt Anja

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference49 articles.

1. Large tuning ratio high aspect ratio variable capacitors using leveraged bending;Achenbach;Microsyst. Technol.,2014

2. Functionalized SU-8 patterned with X-ray lithography;Balslev;J. Vac. Sci. Technol. B,2005

3. Integrated photonics devices on SU8 organic materials;Bêche;Int. J. Phys. Sci,2010

4. Use of SU-8 photoresist for very high aspect ratio X-ray lithography;Bogdanov;Microelectron. Eng.,2000

5. Fabrication of micro-gas chromatograph columns for fast chromatography;Bhushan;Microsyst. Technol.,2007

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1. The SKIF X–Techno Beamline Project;Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques;2023-12

2. Optimization of x-ray lithography conditions for fabrication of large arrays of high-aspect-ratio submicron pores;Journal of Micromechanics and Microengineering;2021-04-13

3. Formation of a fine polymer structure on a plastic substrate through phase separation of a liquid crystal mixture;Journal of Information Display;2020-09-02

4. Self-aligned single-exposure deep x-ray lithography;SYNCHROTRON AND FREE ELECTRON LASER RADIATION: Generation and Application (SFR-2020);2020

5. Dry Film Photoresist Application to a Printed Circuit Board (Pcb) using a Maskless Photolithography Method;International Journal of Technology;2019-10-30
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