Mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps-Reference-Cited by-同舟云学术

Mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps

Published:2018-09 Issue: Volume:259 Page:126-133
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Son Min-Jung,Kim Minwoo,Lee Taik-Min,Kim Jihoon,Lee Hoo-Jeong,Kim Inyoung

Funder

Government-funded Research Program of the Korea Institute of Machinery and Materials

R&D Convergence Program of the National Research Council for Science and Technology for the Republic of Korea

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference19 articles.

1. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering process;Chellvarajoo;Mater. Des.,2015

2. Recent progress in the development of printed thin-film transistors and circuits with high-resolution printing technology;Fukuda;Adv. Mater.,2016

3. Micro-ball wafer bumping for flip chip interconnection;Hashino,2001

4. Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60 μm-pitch solder micro bump interconnections;Huang,2014

5. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints;Kim;J. Alloys Compd.,2003

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1. High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering;Materials Today Communications;2024-12

2. Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading;Microelectronics Journal;2022-03

3. Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles;Flexible and Printed Electronics;2021-09-01

4. Decomposition of pattern distortions by the Spread polynomial model in roll-to-sheet reverse offset printing;Journal of Micromechanics and Microengineering;2020-07-01

5. Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics;Japanese Journal of Applied Physics;2020-02-10