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High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining

  • Published:1999-04 Issue:2 Volume:23 Page:126-133
  • ISSN:0141-6359
  • Container-title:Precision Engineering
  • language:en
  • Short-container-title:Precision Engineering

Author:

Unoa Yoshiyuki,Okada Akira,Okamoto Yasuhiro,Yamazaki Kazuo,Risbud Subhash H,Yamada Yoshiaki

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Semiconductor Technology;Shono,1987

2. Plasma Process Technology for Semiconductor;Sugano,1993

3. Dry Etching Technology for Semiconductor;Tokuyama,1992

4. Microstructuring of silicon by electrodischarge machining (EDM);Dominiek;Sensors and Actuators,1997

5. Fundamental study on electrical discharge machining of single crystalline silicon;Uno;J JSPE,1997

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1. Non-traditional machining techniques for silicon wafers;The International Journal of Advanced Manufacturing Technology;2022-05-25

2. Heat-assisted μ-electrical discharge machining of silicon;The International Journal of Advanced Manufacturing Technology;2021-02-12

3. Microelectrical discharge machining of silicon wafers;Micro Electro-Fabrication;2021

4. The effects of the silicon wafer resistivity on the performance of microelectrical discharge machining;The International Journal of Advanced Manufacturing Technology;2017-10-18

5. Optimizing the Electrical Discharge Drilling Process for High Aspect Micro Hole Drilling in Die Steel;Handbook of Research on Manufacturing Process Modeling and Optimization Strategies;2017
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