Microelectrical discharge machining of silicon wafers-Reference-Cited by-同舟云学术

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Microelectrical discharge machining of silicon wafers

Published:2021 Issue: Volume: Page:219-244
ISSN:
Container-title:Micro Electro-Fabrication
language:
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Author:

Daud Noor Dzulaikha,Hasan Md. Nazibul,Mohamed Ali Mohamed Sultan

Publisher

Elsevier

Reference71 articles.

1. Study of electrical discharge machining technology for slicing silicon ingots;Peng;J. Mater. Process. Technol.,2003

2. TEM study on the electrical discharge machined surface of single-crystal silicon;Murray;J. Mater. Process. Technol.,2013

3. Diamond cutting of silicon with nanometric finish;Fang;CIRP Ann. Manuf. Technol.,1998

4. Surface characteristics and damage of monocrystalline silicon induced by wire-EDM;Punturat;Appl. Surf. Sci.,2014

5. M. Chan et al., Micromachining 3D hemispherical features in silicon via micro-EDM, in: Proceedings of the 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS), 2012, pp. 289–292.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Non-traditional machining techniques for silicon wafers;The International Journal of Advanced Manufacturing Technology;2022-05-25

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