Author:
Chakraborty A.,Duraisami K.,Sathanur A.,Sithambaram P.,Macii A.,Macii E.,Poncino M.
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Reference10 articles.
1. Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects;Ajami;IEEE Trans. CAD,2005
2. D. Brooks, M. Martonosi, Dynamic thermal management for high-performance microprocessors, HPCA-01: IEEE International Conference on High-Performance Computer Architecture, Monterrey, Mexico, January 2001, pp. 171–182.
3. J. Srinivasan, S.V. Adve, Predictive dynamic thermal management for multimedia applications, ICS-03: ACM International Conference on Supercomputing, San Francisco, CA, June 2003, pp. 109–120.
4. K. Skadron, Hybrid architectural dynamic thermal management, DATE-04: IEEE Design Automation and Test in Europe Conference, Munich, Germany, February 2004, pp. 10–15.
5. M. Cho, S. Ahmed, D.Z. Pan, TACO: temperature aware clock-tree optimization, ICCAD-05: IEEE/ACM International Conference on Computer-Aided Design, San Jose, CA, November 2005, pp. 582–587.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献