Author:
Liu Zao,Tan Sheldon X.-D.,Wang Hai,Hua Yingbo,Gupta Ashish
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Reference35 articles.
1. Z. Liu, S.X.-D. Tan, H. Wang, R. Quintanilla, A. Gupta, Compact thermal modeling for package design with practical power maps, in: 1st International IEEE Workshop on Thermal Modeling and Management: Chips to Data Centers (TEMM), July 2011.
2. Z. Liu, S.X.-D. Tan, H. Wang, A. Gupta, S. Swarup, Compact nonlinear thermal modeling of packaged integrated systems, in: Proceedings of Asia South Pacific Design Automation Conference (ASPDAC), January 2013, pp. 157–162.
3. W. Huang, E. Humenay, K. Skadron, M.R. Stan, The need for a full-chip and package thermal model for thermally optimized IC designs, in: Proceedings of the 2005 International Symposium on Low Power Electronics and Design, ACM, New York, NY, USA, 2005, pp. 245–250.
4. Electrothermal Analysis of VLSI Systems;Cheng,2000
5. International Technology Roadmap for Semiconductors (ITRS), 2010 update 〈http://public.itrs.net〉, 2010.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献