Evaluating System Identification Methods for Predicting Thermal Dissipation of Heterogeneous SoCs
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-04580-6_10
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3. Eguia, T.J.A., et al.: General behavioral thermal modeling and characterization for multi-core microprocessor design. In: 2010 Design, Automation Test in Europe Conference Exhibition (DATE 2010), pp. 1136–1141 (2010)
4. Öhrling, J., Truscan, D., Lafond, S.: Enabling fast exploration and validation of thermal dissipation requirements for heterogeneous CPU platforms. In: 2021 IEEE International Conference on Software Testing, Verification and Validation Workshops (ICSTW) (2021)
5. Huang, W., et al.: Accurate, Pre-RTL temperature-aware design using a parameterized, geometric thermal model. IEEE Trans. Comput. 57(9), 1277–1288 (2008)
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