Hot-spot aware thermoelectric array based cooling for multicore processors
Author:
Funder
National Science Foundation
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Reference32 articles.
1. VLSI Systems Long-Term Reliability – Modeling, Simulation and Optimization;Tan,2019
2. M.J. Dousti, M. Pedram, Power-aware deployment and control of forced-convection and thermoelectric coolers, in: 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 2014, pp. 1–6, http://dx.doi.org/10.1145/2593069.2593186.
3. S. Jayakumar, S. Reda, Making sense of thermoelectrics for processor thermal management and energy harvesting, in: 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2015, pp. 31–36, http://dx.doi.org/10.1109/ISLPED.2015.7273486.
4. J. Long, S. Ogrenci Memik, M. Grayson, Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers, in: 2010 Design, Automation Test in Europe Conference Exhibition (DATE 2010), 2010, pp. 117–122, http://dx.doi.org/10.1109/DATE.2010.5457225.
5. M.J. Dousti, M. Pedram, Power-efficient control of thermoelectric coolers considering distributed hot spots, in: 2015 Design, Automation Test in Europe Conference Exhibition (DATE), 2015, pp. 966–971, http://dx.doi.org/10.7873/DATE.2015.0517.
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01
2. Influence of Gravity on Passively Cooled Heat Sink Using Experimental Data and Finite Element Analysis;Processes;2023-03-16
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3