Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments

Author:

Pei Fei,Buchovecky Eric,Bower Allan,Chason Eric

Funder

NSF-DMR

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference58 articles.

1. NASA. Multiple examples of whisker-induced failures are documented on the NASA website. Available: http://nepp.nasa.gov/whisker/.

2. Growth of whiskers from Sn surfaces: driving forces and growth mechanisms;Chason;Prog. Surf. Sci.,2013

3. Accelerated growth of tin whiskers;Fisher;Acta Metall.,1954

4. Pressure-induced growth of metal whiskers;Pitt;J. Appl. Phys.,1964

5. Interdiffusion and reaction in bimetallic Cu-Sn thin films;Tu;Acta Metall.,1973

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