1. NASA, Multiple examples of whisker-induced failures are documented on the NASA website, available at: .
2. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal of the European Union, 2003, L 37/19.
3. Influence of tin deposition methods on tin whisker formation;Pinol;IEEE Trans. Compon. Packag. Manuf. Technol.,2011
4. Understanding the correlation between intermetallic growth, stress evolution, and Sn whisker nucleation;Jadhav;IEEE Trans. Electron. Packag. Manuf.,2010
5. Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation;Chason;JOM,2011