Surface-Energy-Driven Tin Whisker Growth on Pure Tin

Author:

Liu Yushuang1,Huang Miaoyan1,Chen Yue1,Liu Ying1,Zhu Yumeng1,Cui Limin1

Affiliation:

1. Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology, School of Materials Science and Engineering, Nanjing Institute of Technology, Nanjing 211167, China

Abstract

Spontaneous Sn whisker growth, as a reliability issue in electronic assemblies, has drawn much attention in the past several decades. However, the underlying mechanism is still ambiguous. Herein, the growth of Sn whiskers on pure Sn with different specific surface areas was studied to elucidate the effect of surface energy on Sn whisker growth. Though fabricated and cultivated using the same parameters, it was found that Sn whiskers were obtained on the sample of nano-Sn, which possesses excess surface energy, while no whiskers were observed on the sample of micro-Sn, indicating that surface energy plays a significant role in Sn whisker growth. In addition, the whiskering phenomenon is confirmed to be an abnormal recrystallization process according to the microstructure of the whisker root. Therefore, a Sn whisker growth mechanism companied with an abnormal recrystallization process is proposed, which is driven by the excess surface energy. This work provides a new perspective on understanding the long-standing Sn whiskering problem.

Funder

National Natural Science Foundation of China

Scientific Research Foundation of Nanjing Institute of Technology

Publisher

MDPI AG

Subject

Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering

Reference28 articles.

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4. NASA (2023, October 30). Available online: http://nepp.nasa.gov/whisker/failures/index.htm.

5. A tentative theory of metallic whisker growth;Eshelby;Phys. Rev. Lett.,1953

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