Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate-Reference-Cited by-同舟云学术

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Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Published:2008-09 Issue:16 Volume:56 Page:4291-4297
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Gong Jicheng,Liu Changqing,Conway Paul P.,Silberschmidt Vadim V.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Tin–lead (SnPb) solder reaction in flip chip technology

2. Interfacial reactions between lead-free solders and common base materials

3. Reactions of solid copper with pure liquid tin and liquid tin saturated with copper

4. The atomic-scale studies of the behavior of the crystal dissolution in a molten metal

5. Modeling of intermediate phase growth

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1. Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints;Materials Characterization;2024-10

2. Solder Reaction with Cu Alloy C7025 and Its Effect on Solder Joint Reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder;Journal of Materials Research and Technology;2024-03

4. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2024

5. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn;Journal of Materials Research and Technology;2023-09

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