Reactions of solid copper with pure liquid tin and liquid tin saturated with copper
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference10 articles.
1. Interdiffusion and reaction in bimetallic Cu-Sn thin films
2. Reaction-Diffusion in the Cu–Sn System
3. The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
4. Kinetics of interfacial reaction in bimetallic CuSn thin films
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