Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5-Reference-Cited by-同舟云学术

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Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5

Published:2022-02 Issue: Volume:224 Page:117513
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Yang Wenhui,Tran Xuan Quy,Yamamoto Tomokazu,Aso Kohei,Somidin Flora,Tan Xin Fu,Kawami Youichirou,Nogita Kazuhiro,Matsumura Syo

Funder

China Scholarship Council

Australian Research Council

University of Queensland

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. The superstructure of domain-twinned η’-Cu6Sn5;Larsson;Acta Crystallogr. Sect. B Struct. Sci.,1994

2. Crystal structure modulations in η-Cu5Sn4;Larsson;Z. Kristallogr. Cryst. Mater.,1995

3. A new phase in stoichiometric Cu6Sn5;Wu;Acta Mater.,2012

4. Crystal structure of incommensurate ηʺ-Cu1.235Sn intermetallic;Leineweber;Z. Kristallogr. Cryst. Mater.,2020

5. Thermodynamic assessment of the Cu-Sn system;Shim;Int. J. Mater. Res.,1996

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electronic and mechanical properties of η-Cu6Sn5 doped by Ni: A first-principles study;Materials Today Communications;2024-08

2. Effect of Ag Doping on Mechanical Properties of Cu6Sn5 Intermetallic Compounds;Metals;2024-06-07

3. Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium;Journal of Materials Science & Technology;2024-05

4. Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint;Vacuum;2024-01

5. Phase structure of Cu3Sn/Cu and formation of monoclinic Cu grain at this interface during aging;Intermetallics;2023-11

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