Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference67 articles.
1. Advances in lead-free electronics soldering
2. Long term mechanical reliability with lead‐free solders
3. Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales
4. Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
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