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Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects

  • Published:2022-09 Issue: Volume:236 Page:118135
  • ISSN:1359-6454
  • Container-title:Acta Materialia
  • language:en
  • Short-container-title:Acta Materialia

Author:

Zuo Yang,Zhao Cong,Robador Ana,Wickham Martin,Mannan Samjid H.

Funder

China Scholarship Council

University of London

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. Comparison of Wide-Bandgap Semiconductors for Power Electronics Applications;Ozpineci,2004

2. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices;Chen;Acta Mater.,2017

3. Application of GaN in 5G Technology;Wang;J. Phys.: Conf. Ser.,2020

4. An assessment of wide bandgap semiconductors for power devices;Hudgins;IEEE Trans. Power Electron.,2003

5. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints;Chen;J. Alloys Compd.,2021
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