Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition-Reference-Cited by-同舟云学术

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Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

Published:2012-11 Issue: Volume:82 Page:372-377
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Inoue Fumihiro,Shimizu Tomohiro,Miyake Hiroshi,Arima Ryohei,Ito Toshihiko,Seki Hirofumi,Shinozaki Yuko,Yamamoto Tomohiko,Shingubara Shoso

Funder

Ministry of Education, Culture, Sports, Science and Technology

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference30 articles.

1. Hydrogen Embrittlement of Electroless Copper Deposits

2. A Study on Activation and Acceleration by Mixed PdCl2 / SnCl2 Catalysts for Electroless Metal Deposition

3. Controlled Mechanical Adhesion of Electroless Cu Patterns

4. Covalent Binding of Pd Catalysts to Ligating Self‐Assembled Monolayer Films for Selective Electroless Metal Deposition

5. Electroless deposition and electrical resistivity of sub-100nm Cu films on SAMs: State of the art

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1. Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO₂ for High Aspect Ratio Through-Silicon Via Technology in 3D Integration;ACS Applied Electronic Materials;2024-03-14

2. Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization;Journal of The Electrochemical Society;2022-07-01

3. TSV fabrication technology using direct electroplating of Cu on the electroless plated barrier metal;2022 IEEE International Interconnect Technology Conference (IITC);2022-06-27

4. An optimized Ni P seed layer coating method for through glass via (TGV);Microelectronic Engineering;2022-03

5. Research Progress of Electroless Plating Technology in Chip Manufacturing;Acta Chimica Sinica;2022

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