Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling
Author:
Funder
National Research Foundation of Korea
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference59 articles.
1. Superconformal deposition;Josell,2020
2. Via-filling using electroplating for build-up PCBs;Kobayashi;Electrochim. Acta,2001
3. Electrodeposition of copper for three-dimensional metamaterial fabrication;Yang;ACS Appl. Mater. Interfaces,2017
4. Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition;Chen;Electrochim. Acta,2014
5. Superconformal electrodeposition of copper in 500–90nm features;Moffat;J. Electrochem. Soc.,2000
Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. 1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-08
2. Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application;Journal of Manufacturing Processes;2024-07
3. Investigation of a Single-Component Additive for Bottom-Up Superfilling of the High-Aspect-Ratio TSV by Theoretical and Experimental Studies;The Journal of Physical Chemistry C;2024-06-15
4. Cu microvia filling by pulse-reverse electrodeposition with a single accelerator;Electrochimica Acta;2024-06
5. Effect of Halides on MPS Orientation and Cu Deposition Rates at Cu Surfaces;Journal of The Electrochemical Society;2024-04-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3