Electrodeposition of Sn–Bi lead-free solders: Effects of complex agents on the composition, adhesion, and dendrite formation
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference33 articles.
1. Effect of polyoxyethylenelaurylether on electrodeposition of Pb-free Sn–Bi alloy
2. Effects of plating parameters on alloy composition and microstructure of Sn–Bi electrodeposits from methane sulphonate bath
3. Solid Logic Technology: Versatile, High-Performance Microelectronics
4. Electrodeposition of Pb-free Sn alloys in pulsed current
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