Effect of Ansa as an Additive on Electrodeposited Sn-Ag-Cu Alloy Coatings in Deep Eutectic Solvents-Reference-Cited by-同舟云学术

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Effect of Ansa as an Additive on Electrodeposited Sn-Ag-Cu Alloy Coatings in Deep Eutectic Solvents

Published:2024 Issue: Volume: Page:
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Author:

Huang Jiacheng,Wang Wenchang,Wu Qihu,Ming Zhiyao,Qin Shuiping,Wang Pengju,Mitsuzaki Naotoshi,Chen Zhidong

Publisher

Elsevier BV

Reference30 articles.

1. Electrodeposition of lead dioxide induces the fabrication of perovskite FAPbI3 film and electron-transport-layer-free solar cells;Q Li;Sol. Energy,2022

2. Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition;S Joseph;Mater. Sci. Eng,2010

3. Measuring the sustainability of tin in China;C R Yang;Sci. Total Environ,2018

4. Skip;S O Cassell;The electrodeposition of tin and its alloys,1996

5. Electrodeposition of tin alloys from alkaline stannate baths;R G Monk;Trans. Faraday Soc,1935

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