Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent
Author:
Funder
Changsha Science and Technology Project
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
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2. Preparation of Tunable Cu−Ag Nanostructures by Electrodeposition in a Deep Eutectic Solvent;ChemElectroChem;2024-03-28
3. Effect of Ansa as an Additive on Electrodeposited Sn-Ag-Cu Alloy Coatings in Deep Eutectic Solvents;2024
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