Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder-Reference-Cited by-同舟云学术

Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

Published:2016-10 Issue: Volume:65 Page:255-264
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ramli M.I.I.^ORCID,Saud N.,Salleh M.A.A. Mohd,Derman M.N.,Said R. Mohd

Funder

Nihon Superior Co. Ltd., Japan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference48 articles.

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3. Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder;Gain;J. Mater. Sci. Mater. Electron.,2016

4. Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate;Gain;J. Mater. Sci. Mater. Electron.,2016

5. Wetting behaviour and reactivity of lead free Au-In-Sn and Bi-In-Sn alloys on copper substrates;Gnecco;Int. J. Adhes. Adhes.,2007

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