New Sn–0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference30 articles.
1. Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
2. Lead-free Solders in Microelectronics
3. High-temperature lead-free solder alternatives
4. Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In
5. Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys
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1. Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding;Journal of Welding and Joining;2023-08-31
2. Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2023-02-21
3. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method;Journal of Materials Science: Materials in Electronics;2023-01-31
4. Research on Bi contents addition into Sn–Cu-based lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2022-06-08
5. Low Temperature Soldering 6061 Aluminum Alloys by Using the Synthesized Sn9Zn Nano-Amorphous Particles;Metals and Materials International;2021-11-13
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