Electrodeposition of copper on an Au(111) electrode modified with mercaptoacetic acid in sulfuric acid-Reference-Cited by-同舟云学术

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Electrodeposition of copper on an Au(111) electrode modified with mercaptoacetic acid in sulfuric acid

Published:2016-06 Issue: Volume:203 Page:272-280
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Lai Chao-Shan,Hu Xiao-Xuan,Yau Shuehlin,Dow Wei-Ping,Lee Yuh-Lang

Funder

Ministry of Science and Technology of ROC

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference59 articles.

1. Superconformal Electrodeposition of Copper

2. Damascene copper electroplating for chip interconnections

3. Superconformal film growth: Mechanism and quantification

4. The chemistry of additives in damascene copper plating

5. Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

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1. Evolution of Texture, Strain, and Grain Boundary Constitution in Copper–Chromium Coatings and its Effect on Coating Corrosion Behavior;Metallurgical and Materials Transactions A;2021-11-21

2. Fabrication of underpotentially deposited Cu monolayer/electrochemically reduced graphene oxide layered nanocomposites for enhanced ethanol electro-oxidation;Applied Catalysis B: Environmental;2018-11

3. Contrasts in Copper Deposition on Pt(111) Modified by 1-Mercaptopropionic and 1-Mercaptoacetic Acids as Probed by Voltammetry and STM;Journal of The Electrochemical Society;2018

4. Characterization of Copper Coating Electrodeposited on Stainless Steel Substrate;International Journal of Electrochemical Science;2017-07

5. Substrate effect on electrodeposited copper morphology and crystal shapes;Surface Engineering;2017-05-09

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