Effect of cerium on wettability of mechanically milled Cu-based brazing alloy powder-Reference-Cited by-同舟云学术

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Effect of cerium on wettability of mechanically milled Cu-based brazing alloy powder

Published:2018-11 Issue:11 Volume:36 Page:1226-1233
ISSN:1002-0721
Container-title:Journal of Rare Earths
language:en
Short-container-title:Journal of Rare Earths

Author:

Wu Qiaoping,Luo Zhou,Wang Yu,Zhao Heng,Zheng Weijia

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province

Publisher

Elsevier BV

Subject

Geochemistry and Petrology,General Chemistry

Reference22 articles.

1. Investigation on the brazing mechanism and machining performance of diamond wire saw based on Cu-Sn-Ti alloy;Zhang;Int J Refract Met Hard Mater,2017

2. Influence of brazing parameters and alloy composition on interface morphology of brazed diamond;Klotz;Mater Sci Eng A,2008

3. Microstructure, residual stresses and shear strength of diamond-steel-joints brazed with a Cu-Sn based active filler alloy;Buhl;Int J Refract Met Hard Mater,2012

4. Interface characteristics and fracture behavior of brazed polycrystalline CBN grains using Cu-Sn-Ti alloy;Ding;Mater Sci Eng A,2013

5. Microstructure development of Cu-Sn-Ti alloys on graphite;Hsieh;J Alloys Compd,2008

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1. Rare earth modified reduced graphene oxide reinforced AgCuTi composite brazing filler for brazing C/C composites;Journal of Central South University;2024-05

2. Effect of PMMA pore former on mechanical strength and performance of glass fibre metal-bonded porous diamond blocks with Cu–Sn–Ti solder alloys;Diamond and Related Materials;2024-04

3. Comparative study on induction brazing of diamond with rare earth Nd-doped crystalline and amorphous Ni-based filler alloy;Journal of Materials Research and Technology;2024-01

4. 1000 °C High-Temperature Wetting Behaviors of Molten Metals on Laser-Microstructured Metal Surfaces;Langmuir;2023-11-22

5. Exploring the role of indium on the microstructure evolution and interface bonding behavior of brazing diamond abrasive with modified Cu–Sn–Ti;Diamond and Related Materials;2023-06

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