Equivalent strengths for reliability assessment of MEMS structures

Author:

Chen Kuo-Shen,Ou Kuang-Shun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Material issues in microelectromechanical systems (MEMS);Spearing;Acta Mater.,2000

2. Effect of specimen size on Young’s modulus and fracture strength of poly-silicon;Sharpe;J. Microelectromech. Syst.,2001

3. S. Brown, et al. (Eds.), Microelectromechanical Structures for Materials Research, in: Proceedings of the Material Research Society Symposium, vol. 518, 1998.

4. Fracture testing of bulk silicon microcantilever beams subjected to a side load;Wilson;J. Microelectromech. Syst.,1996

5. Trailing and testing the fracture strength of silicon at the mesoscale;Chen;J. Am. Ceram. Soc.,2000

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