Thin film thermal sensor for real time measurement of contact temperature during ultrasonic wire bonding process-Reference-Cited by-同舟云学术

Thin film thermal sensor for real time measurement of contact temperature during ultrasonic wire bonding process

Published:2004-03 Issue:2-3 Volume:111 Page:188-195
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Ho Jeng-Rong,Chen Chun-Chou,Wang Chen-Hao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. N.E. Weare, J.N. Antonevich, R.E. Monroe, Fundamental studies of ultrasonic welding, Weld. J. Res. Suppl. 39 (1960) 331–337.

2. K.C. Joshi, The formation of ultrasonic bonds between metals, Weld. J. 50 (1971) 840–848.

3. A.P. Hulst, C. Lasance, Ultrasonic bonding of insulated wire, Weld. J. 57 (1978) 19–25.

4. J. Devine, Joining electric contacts? Ultrasonics works fast, Weld. Des. Fabrication (1980) 112–115.

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