Wafer level vacuum encapsulated tri-axial accelerometer with low cross-axis sensitivity in a commercial MEMS Process-Reference-Cited by-同舟云学术

Wafer level vacuum encapsulated tri-axial accelerometer with low cross-axis sensitivity in a commercial MEMS Process

Published:2015-12 Issue: Volume:236 Page:25-37
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Merdassi Adel,Kezzo Mohamed Nizar,Xereas George,Chodavarapu Vamsy P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference37 articles.

1. Inertial MEMS Principles and Practice;Kempe,2011

2. MEMS for Automotive and Aerospace Applications;Kraft,2013

3. Area variable capacitive microaccelerometer with force-balancing electrodes;Ha;Proc. Soc. Photo-Opt. Ins.,1997

4. Analog Devices: http://www.analog.com/en/products/mems/mems-accelerometers.html.

5. ST Microelectronics: http://www.st.com/web/en/catalog/sense_power/FM89/SC444?icmp=sc444_pron_accelerometers_aug2013&sc=accelerometers-nb-aug13.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Systematic Design Optimization Approach for Multiphysics MEMS Devices Based on Combined Computer Experiments and Gaussian Process Modelling;Sensors;2021-10-30

2. Through‐substrate Vias;3D and Circuit Integration of MEMS;2021-04-23

3. Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies;Sensor Review;2020-07-08

4. Highly sensitive MEMS frequency modulated accelerometer with small footprint;Sensors and Actuators A: Physical;2020-06

5. A class of biaxial micro/meso-scale structures for isotropic in-plane inertial sensing and actuation: design, fabrication and experiments;Microsystem Technologies;2020-03-13