Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Micromachined packaging for chemical microsensors;Smith;IEEE Trans. Electron Devices,1988
2. CMOS compatible wafer scale adhesive bonding for circuit transfer;Vander Groen,1997
3. Wafer bonding for silicon-on-insulator technologies;Lasky;Appl. Phys. Lett.,1986
4. Silicon-to-silicon direct bonding method;Shimbo;J. Appl. Phys.,1986
5. Field assisted glass–metal sealing;Wallis;J. Appl. Phys.,1969
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献