Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging-Reference-Cited by-同舟云学术

Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging

Published:2023-11 Issue:11 Volume:59 Page:1-5
ISSN:0018-9464
Container-title:IEEE Transactions on Magnetics
language:
Short-container-title:IEEE Trans. Magn.

Author:

Hofmann Christian¹^ORCID,Kroll Martin²^ORCID,Panhale Sushant²,Wiemer Maik¹,Kunke Andreas²,Hiller Karla³^ORCID,Kuhn Harald¹

Affiliation:

1. Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany

2. Institute for Machine Tools and Production Processes, University of Technology, Chemnitz, Germany

3. Center for Microtechnologies, University of Technology, Chemnitz, Germany

Funder

German Federal Ministry of Economic Affairs and Energy

German Federation of Industrial Research Associations (AiF) within the Zentrales Innovationsprogramm Mittelstand (ZIM) Project “Ultra High Frequency (UHF)-Bond” [Förderkennzeichen (FK)]

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/20/10294220/10153084.pdf?arnumber=10153084

Reference10 articles.

1. Silver sintering technology based on induction heating for chip level bonding

2. Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils

3. Impact of SiO2on Al–Al thermocompression wafer bonding

4. Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser

5. Handbook of Wafer Bonding

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