Author:
Nagarajan Ranganathan,Prasad Krishnamachar,Ebin Liao,Narayanan Balasubramanian
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. System-on-a-chip: What industry needs to do;Scholten;Solid State Technol.,2000
2. Beyond Moore's law: the interconnect era;Meindl;IEEE Comput. Sci. Eng.,2003
3. Interconnect opportunities for gigascale integration;Meindl;IBM J. Res. Dev.,2002
4. Multichip module: next generation packages;Johnson;IEEE Spectr.,1990
5. New three-dimensional wafer bonding technology using the adhesive injection method;Matsumoto;Jpn. J. Appl. Phys.,1998
Cited by
35 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献