Author:
Rong Hua,Huang Qing-An,Nie Meng,Li Weihua
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. RF MEMS switches and switch circuits;Rebeiz;IEEE Microwave Mag.,2001
2. Micromachined devices for wireless communications;Nguyen;Proc. IEEE,1998
3. New methods for measuring mechanical properties of thin films in micromaching: beam pull-in voltage (VPI) method and long beam deflection (LBD) method;Zou;Sens. Actuators A,1995
4. M-TEST: a test chip for MEMS material property measurement using electrostatically actuated test structures;Osterberg;J. Microelectromech. Syst.,1997
5. R.K. Gupta, Electrostatic pull-in test structure design for in-situ mechanical property measurement of microelectromechanical systems (MEMS), Ph.D. dissertation, MIT, Cambridge, MA, 1997, pp. 10–27.
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