The electrochemical corrosion behavior of Pb–free Sn–8.5Zn–XCr solders in 3.5 wt.% NaCl solution-Reference-Cited by-同舟云学术

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The electrochemical corrosion behavior of Pb–free Sn–8.5Zn–XCr solders in 3.5 wt.% NaCl solution

Published:2015-11 Issue: Volume:168 Page:27-34
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Liu Moumiao,Yang Wenchao,Ma Yueyuan,Tang Chenghuang,Tang Hongqun,Zhan Yongzhong

Funder

Guangxi Science and Technology Development Project

Science and Technology Project of Guangxi Education Department

Science and Technology Development Project of Qingxiu District, Nanning

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference28 articles.

1. Development of Sn–Zn lead-free solders bearing alloying elements

2. Recent advances on Sn–Cu solders with alloying elements: review

3. Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

4. Depressing effect of 0.1wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

5. Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy

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3. Effect of Glucose Contents on Electrochemical Corrosion Behavior of Ti/ZrO₂ Brazing Joint in SBF;ACS Biomaterials Science & Engineering;2023-02-27

4. Study on the preparation and properties of Sn–0.7Cu–xBi alloy;RSC Advances;2023

5. Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution;Materials Science and Technology;2022-12-26

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