Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads
2. Interfacial reactions between Sn–9Zn+Cu lead-free solders and the Au substrate
3. On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material
4. Pb-free solder-alloy based on Sn–Zn–Bi with the addition of germanium
5. Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys
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