Depressing effect of 0.1wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
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3. Investigation on properties of Sn–8Zn–3Bi lead-free solder by Nd addition;Zhou;J Alloys Compd,2009
4. Effect of cooling rate on the room-temperature impression: creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders;Mahmudi;Mater Sci Eng A,2008
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2. Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy;Journal of Materials Research and Technology;2023-09
3. Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding;Journal of Welding and Joining;2023-08-31
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