Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates
Author:
Funder
National Science Council of Taiwan
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference35 articles.
1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R Rep.,2000
2. Phase diagrams of Pb-free solders and their related materials systems;Chen;J. Mater. Sci. Mater. Electron.,2007
3. Phase transformation and microstructural evolution in solder joints;Chen;JOM,2007
4. Reliability issues for flip-chip packages;Ho;Microelectron. Reliab.,2004
5. 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections;Sakuma;IBM J. Res. Dev.,2008
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties;Materials Science and Engineering: A;2022-12
2. Low melting point solders based on Sn, Bi, and In elements;Materials Today Advances;2020-12
3. Formation of Fe-Sn intermetallic layer and its effect on the corrosion of 304 stainless steel in high temperature water;International Journal of Electrochemical Science;2019-04
4. Effect of Zinc Addition on the Microstructure, Thermal and Mechanical Properties of Indium-Tin-xZinc Alloys;Journal of Electronic Materials;2018-11-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3