Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections-Reference-Cited by-同舟云学术

Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections

Published:2013-11 Issue:2-3 Volume:142 Page:682-685
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Wierzbicka-Miernik A.,Miernik K.,Wojewoda-Budka J.,Szyszkiewicz K.,Filipek R.,Litynska-Dobrzynska L.,Kodentsov A.,Zieba P.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

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