Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection-Reference-Cited by-同舟云学术

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Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

Published:2020-09 Issue: Volume:252 Page:123230
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Yin Da,Yang Liu,Ma Tengda,Xu Yi,Tan Baimei,Yang Fan,Sun Xiaoqin,Liu Mengrui

Funder

Major National Science and Technology Special Projects

Natural Science Foundation, China

Hebei Natural Science Foundation Project

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference49 articles.

1. Effect of a novel chelating agent on defect removal during post-CMP cleaning;Hong;Appl. Surf. Sci.,2016

2. Study on the weakly alkaline slurry of copper chemical mechanical planarization for GLSI;Yao;ECS J. Solid State Sci. Technol.,2017

3. Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process;Cho;Appl. Surf. Sci.,2016

4. Post-CMP cleaning solutions for the removal of organic contaminants with reduced galvanic corrosion at copper/cobalt interface for advanced Cu interconnect applications;Seo;ECS J. Solid State Sci. Technol.,2019

5. Removal of BTA adsorbed on Cu: a feasibility study using the quartz crystal microbalance with dissipation (QCMD) technique;Wu;ECS J. Solid State Sci. Technol.,2019

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