Effect of a novel chelating agent on defect removal during post-CMP cleaning-Reference-Cited by-同舟云学术

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Effect of a novel chelating agent on defect removal during post-CMP cleaning

Published:2016-08 Issue: Volume:378 Page:239-244
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Hong Jiao^ORCID,Niu Xinhuan,Liu Yuling,He Yangang,Zhang Baoguo,Wang Juan,Han Liying,Yan Chenqi,Zhang Jin

Funder

Major National Science and Technology Special Projects

Education-funded research projects of Hebei Province

Natural Science Foundation of Hebei Province

Colleges and Universities Scientific research project of Hebei Province

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference18 articles.

1. The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide;Kwon;Tribol. Int.,2013

2. Relative roles of acetic acid, dodecyl sulfate and benzotriazole in chemical mechanical and electrochemical mechanical planarization of copper;Goonetilleke;Appl. Surf. Sci.,2008

3. Chemical roles on Cu-slurry interface during copper chemical mechanical planarization;Li;Appl. Surf. Sci.,2014

4. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry;Cheng;Appl. Surf. Sci.,2015

5. Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP);Xu;Appl. Surf. Sci.,2011

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1. Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-09

2. Recent Advances in CMP Slurries: Composition and Analysis Perspectives;Ceramist;2024-06-30

3. Electrochemistry of copper post-CMP cleaning examined in combination with brush-scrubbing in a malonic acid solution;Journal of Electroanalytical Chemistry;2024-01

4. Preparation and Performance Testing of Green Non-toxic Polishing Solution for Medical Titanium Alloy;ECS Journal of Solid State Science and Technology;2024-01-01

5. Exploration of Post-Cmp Cleaning - New Insights into the Synergistic Effect of Particle Removal of Surfactants in Citric Acid Based Systems: Experimental and Mechanistic Analysis;2024

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