Enhancement of breakdown strength and electromigration reliability for cobalt lines lightly doped with boron

Author:

Tsai Ting-Kan,Shih I-Ting,Cheng Yi-Lung,Chen Giin-ShanORCID,Fang Jau-ShiungORCID

Funder

Taiwan Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference62 articles.

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2. Surface and grain boundary scattering in nanometric Cu thin films: a quantitative analysis including twin boundaries;Barmak;J. Vac. Sci. Technol., A,2014

3. Influence of phonon, geometry, impurity, and grain size on copper line resistivity;Plombon;Appl. Phys. Lett.,2006

4. Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies;van der Veen,2015

5. Exploring alternative metals to Cu and W for interconnects applications using automated first-principles simulations;Sankaran;ECS J. Solid State Sci. Technol.,2015

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